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Product Details
| Product | Composition | Average MolecularWeight (g/mol) | Tm (oC) | Tg (oC) | Performance |
| XCP-3000H | AA/HDO | 3000 | 55 | shortens open time, lowers melt viscosity, increases initial strength | |
| FLP-3500H | 3500 | 55 | |||
| XCP-R4500H | 4500 | 55 | |||
| XCP-R8500HA | 8500 | 57 | |||
| NOTP-3870-A3 | DDA/HDO | 3500 | 70 | ||
| CTP-44 | AA/BDO | 2000 | 50 | increases strength, lowers application temperature | |
| XCP-TM3000B | 3000 | 55 | |||
| FLP-2000N | AA/NPG | 2000 | -48 | increases flexibility, improves solvent resistance | |
| PES-2000NB | AA/NPG/BDO | 2000 | -58 | increases flexibility, improves hydrolysis resistance | |
| PES-2200NH | AA/NPG/HDO | 2000 | -60 | ||
| CTP-244 | AA/EG/BDO | 2000 | -62 | ||
| XCP-R2170 | - | 4000 | -15 | extends open time, increases flexibility, lowers melt viscosity, improves adhesion to non-polar (low energy) substrates | |
| XCP-R2370 | - | 4000 | -30 | ||
| XCP-R2570 | - | 5500 | -55 | ||
| FLP-PA1000N | PA/NPG | 1000 | 26 | increases melt viscosity, increases initial strength, improves adhesion to polar substrates | |
| XCP-R3170 | - | 3000 | 30 | ||
| XCP-R5170 | - | 2600 | 50 | ||
| XCPA-2000HL | PA/HDO | 2000 | -15 | extends set time, lowers melt viscosity，improves adhesion to non-polar (low energy) substrates | |
| XCP-2000IPS | - | 2000 | -22 | improves hydrolysis resistance, improves thermal stability |
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